无机非金属材料粘接应用技术研究进展

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中图分类号：TQ427 文献标志码：A 文章编号：1001-5922（2026）03-0610-04

Research progress on bonding application technology of inorganic non-metallic materials

ZHANG Wenjie（BeijingNormal University，Beijing1OO875，China）

Abstract：Inorganic bonding technology has becomea keysupporting technology for extreme environment engineeringand high-end manufacturing due to its excellent high temperature resistance，chemical corosion resistance and mechanical stability.This study systematically reviews the fourcore mechanisms of chemical bonding，physicaladsorption，mechanicalbondingandinterface reaction，clasifiesand elaborates thecomposition，performance and modification pathsofsilicate-based，phosphate-based，oxide-basedandceramic-basedbinders，analyzes the influence laws of substrate surface treatment，coating process and curing system on bonding performance，and summarizes its typical application cases in the fields ofaerospace，electronic power，metalurgical industry，constructionengineering and newenergy.Aiming atthekeyproblemssuch as low low-temperature curing efficiency，insufficient toughness anddifficult regulationof interfacecompatibility，the future development directions suchasnanocompositemodification，multi-functional integrated designand intelligentprocessoptimizationare proposed.Thisstudyprovidesareference forthe theoretical innovationand engineering application ofinorganic bonding technology，and helps the industrial upgrading of high-end inorganic bonding materials.

Key words：inorganic adhesive;bonding mechanism; process optimization;extreme environment application; nano. composite modification

粘接技术是材料连接的核心手段，广泛应用于工业生产及高端制造领域[1]。（剩余8451字）