一种基于I3C协议的主机-光模块通信系统设计及信号仿真
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中图分类号：TN914 文献标志码：A 文章编号：2095-2945（2026）08-0005-08
Abstract：InordertosolvethebotleneckofbandwidthandeffciencyoftraditionalI2Cbusinhigh-speedopticalmodule communication，ahostopticalmodulecommunicationsystembasedon3Cprotocolwasproposed，whichaimstooptiiergister configuration，statusmonitoringandhardwareresourcemanagementthroughtheeficientcharacteristicsofI3C.Thesystemdesign includesI3Cmastercontroleropticalmoduleslavedeviceandphysicallayerinterface，inovativelyintroducesdynamicddre alocationandgroupaddressalocationmechanisms，usestheuniquein-bandinterupt（IBI）oftheI3Cprotocoltoreplacethe physicalinterruptpin，andimprovesthetransmissonratethrough HDR（HighDataRate）mode.Thegroupaddress function greatlyimprovesthefciencyofulti-ouleontrol，anddynamicadressalocationandin-bandinteruptoptimizationreduce hardware pinresourceusage.Basedonthe HPEAruba 840OchassissizeandtheAlteraseriesCycloneIVFPGA，asignal integritysimulationplatformwasbuilt，andADStolswereusedtobuildasimulationenvironmentincludingIBISdrivermodel， PCBchanellossmodelanddaisy-chaintopology，andthesignalqualityat3.3VLVCMOSlevelwasanalyzed.Theequivalent rateof HDR-DDRmodeofthesystemreaches 25 Mbpsat12.5MHz clock，andthesimulationshows thattheminimumeye heightofthe2Ooptical modulesis2.31V，thelowlevelislessthanO.99V，andtheminimumeye widthis74ns，whichmeets theI3Cprotocollevelrequirements.Inthispaper，thelowlatencyhighthroughputandhardwaresimplcityoftheopticalmodule communicationsystemarerealizedthroughtheinnovativeaplicationof3Cprotocol，andthefeasibiltyoftheopticalodulein high-speedscenariosisverifiedbysimulation，whichprovidestechnicalsupportfortheevolutionofopticalmodulestohigher transmissionrateandlowerpower consumption.Thedesigncan beextended to high-performance computingpowerapplication scenarios that require large-scale optical module management， such as cloud computing and 5G.
Keywords：I3C；opticalmodule;dynamicaddress；goupadressin-bandinterupt;sigalintegritysimulation;comuication system
I3C（Improved Inter-Integrated Circuit）是一种改进的集成电路接口，在2016年由MIPI联盟开发提出，适用于消费电子、可穿戴设备和工业物联网等。（剩余7645字）
