“Q”型引线成形热力耦合仿真及结构优化设计

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中图分类号：TN602-34；TH122 文献标识码：A 文章编号：1004-373X（2026）06-0007-08

Thermao-mechanical coupling simulation and structural optimization design of 66Ω95 type lead forming

YUXinbo1，WANGDaokuan2，YUEXiaodong²，YUHuiping1 （1.CollegeofMechanicalandEnergyEngineering，BeijignUniversityofTechnology， 2.The12thResearch Instituteof China Electronics Technology Group Corporation，Beijing1Ooo15，China）

Abstract：In order to improve the relief ability of " Ω "type lead forming stress，and alleviate the problem of fracture failure causedbythermalstressofelectroniccomponentleadsunderhightemperaturegradient，thetheoreticalanalysisofeliefabilityof = Ω "typeleadformingatthethermal stressisconducted.Consideringtheinhomogeneityofthematerialpropertiesalogthe lengthoftheleadunderhightemperaturegradient，thethermao-mechanicalcouplingsimulationmodeloftheleadisestablished， and thecalculation formulaofthelead safety factorisproposed.Based on the surogate model，anoptimisation modelof " Ω " type leadformingisestablishedbasedonsurrogatemodel，andtheglobaloptimisationsolutioniscarriedoutbymeansofmixed integersequencequadratic programming（MSQP）algorithm.Thetheoreticalanalysisandsimulationresearchresultsshowthat，in thehigh temperature gradient environment， the stressreliefabilityof the" Ω "typelead isrelated to thesize of thepositionof the arcithemiddleofthelead.Withtheincreaseofthearcradius，thestressreliefcapacityisimproved.Afterstructural optimisationdesign，thebestleadformingschemeisobtained，andthesafetyfactoroftheoptimisedleadisincreasedfrom1.09 to 5.75，which significantly improves the reliability of the use of the lead.

Keywords：" Ω "type lead;lead forming;thermo-mechanical coupling; stressrelief; high temperature environment; surrogate model; structural optimization

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