基于有限元仿真的CPUSocket扣具背板优化设计

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中图分类号：TN601；TP391.99 文献标志码：B

Optimization design of CPU Socket backplate clamping mechanism based on finite element simulation

ZHANG Yuanzhi， PENG Yongming，TANG Xiaobo

Shanghai Aerospace Science and Technology Electric Apliance Research Institute Co.，Ltd.，Shanghai 2Oo331，China）

Abstract：As to the issue of excessive structural deformation in the existing CPU Socket backplate clamping mechanism，the stress and deformation of the current backplate structure is evaluated by the finite element method， identifying stress concentration zones and areas with significant deformation. Combining opening techniques，four optimization design schemes for backplate openings are developed. The stress distribution and deformation metrics of the four optimized backplate designs are compared using finite element analysis software，and ultimately the most suitable optimization solution is selected. Simulation and test results show that，while meeting strength requirements，the optimized backplate structure can effectively reduce the stress concentration and deformation，meeting the industry standard requirements.

Key words： CPU Socket backplate clamping mechanism； backplate opening； structural optimization;stress concentration；finite element

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